Multi-purpose BGA Reballing Stencil Kit for Phone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness | Инструменты



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Цена:792,66 - 891,28RUB
*Стоимость могла изменится

Количество:


Новое поступление

WeTradeTek Tools Store

WeTradeTek Tools Store

Магазина WeTradeTek Tools Store работает с 04.08.2019. его рейтинг составлет 93.65 баллов из 100. В избранное добавили 1567 покупателя. Средний рейтинг торваров продавца 4.8 в продаже представленно 257 наименований товаров, успешно доставлено 2711 заказов. 1292 покупателей оставили отзывы о продавце.

Характеристики

Multi-purpose BGA Reballing Stencil Kit for Phone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness | Инструменты

История изменения цены

*Текущая стоимость 792,66 - 891,28 уже могла изменится. Что бы узнать актуальную цену и проверить наличие товара, нажмите "Добавить в корзину"

Месяц Минимальная цена Макс. стоимость Цена
Mar-17-2026 942.69 руб. 989.42 руб. 965.5 руб.
Feb-17-2026 935.17 руб. 982.73 руб. 958.5 руб.
Jan-17-2026 784.33 руб. 823.25 руб. 803.5 руб.
Dec-17-2025 919.24 руб. 965.93 руб. 942 руб.
Nov-17-2025 800.86 руб. 840.12 руб. 820 руб.
Oct-17-2025 903.94 руб. 948.43 руб. 925.5 руб.
Sep-17-2025 895.28 руб. 940.50 руб. 917.5 руб.
Aug-17-2025 887.55 руб. 931.22 руб. 909 руб.
Jul-17-2025 879.3 руб. 923.45 руб. 901 руб.

Описание товара

Multi-purpose BGA Reballing Stencil Kit for Phone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness | ИнструментыMulti-purpose BGA Reballing Stencil Kit for Phone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness | ИнструментыMulti-purpose BGA Reballing Stencil Kit for Phone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness | ИнструментыMulti-purpose BGA Reballing Stencil Kit for Phone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness | ИнструментыMulti-purpose BGA Reballing Stencil Kit for Phone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness | ИнструментыMulti-purpose BGA Reballing Stencil Kit for Phone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness | Инструменты


Multi-purpose BGA Reballing Stencil Kit for iPhone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness

 

Feature:

1.0.12mm thickness 2.Imported Japan Steel 3.Anti-drum design

 

Dear Customer :

Thank you very much for your visiting our store!Our product 100% from orgainal factory if you have any questions,Please feel free to contact with us, best service will be provided, Please do not open dispute or leave negative feedback directly, many thanks !

About Shipping:

1.We can send out quickly since we have inventory,Normally we can send out your product in 2 working days 2.For some country, the shipping cost maybe very high, you can buy in bulk so save you some shipping cost 3.If we found your place in remote area in logistic system, we will check with you to find a best way to save your cost 4.Please kindly note our product price are not including the custom duties and remote delivery costs.if you have any requirement, please contact me before shipping.

After-sales Policy:

If the product does not match the description, we will 100% refund, please ensure the product in original status We will provide video technical support, Online support if you need

Brand Story

WeTradeTek a professional team for phone repair tools, accessories,machine etc.we have been this field for more than 5 years, if you have any other questions, welcome for inquiry , hope you have a joyful shipping !


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